China: Project Application Guide for the Shenzhen Science and Technology Innovation Commission's 2024 Annual Integrated Circuit Special Project Subsidy Program

1. 2. Subsidies for first-time completion of full-mask (全掩膜) engineering
2. 1. For enterprises using MPWs to conduct R&D, subsidies of up to 70% of
3. 2. For enterprises that have completed full-mask engineering product
4. 1. The applying work unit (申请单位; "applicant") should be an enterprise
5. 2. The applicant should have sites, facilities, and personnel for R&D in
6. 3. The applicant shall not be listed in the Shenzhen Scientific Research
7. 4. The applicant for a project shall not be in a situation where it has failed to
8. 5. The applicant shall not make multiple applications or repeated applications
9. 1. Tape-out support for IC design enterprises
10. 2. IP purchase support for IC design enterprises
11. 3. Support for the R&D of IC EDA design tools
12. 2. A copy of the 2022 special audit report on R&D investment, which has a
13. 1. In these Guidelines, multi-project wafer (MPW) refers to where tape-out
14. 2. First-time full-mask engineering product tape-out (full mask) refers to the
15. 3. Silicon intellectual property, or IC IP core (IP) refers to IC modules that have
16. 4. Professional service agency specifically refers to an IC design service
17. 5. The invoices (overseas: delivery invoices) issued by wafer fabs and mask

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